AOI Inspection Equipment Stencil Inspection Machine System SVII-H6 for Semiconductor Stencil Inspection & Wafer

New AOI Stencil Inspection Machine System SVII-H6 for Semiconductor Stencil Inspection & Wafer

The wave of lightweight, thin, short, small and portable electronic products continues to advance, the requirements of electronic products manufacturing technology are increasingly stringent.

Currently solder paste printing technology accounts for more than 50% of the poor PCBA, the quality of stencil is the key point of control.

For a long time, the inspection of stencil quality in factories is limited to measuring tension, the effective management of the roughness of stencil aperture wall, the accuracy of stencil aperture size, the accuracy of stencil aperture position, the thickness of stencil and the cleanliness of stencil are neglected. There is no standard, no data makes it impossible to trace back problems in the later stage.

With the mass use of 01005 and 0.3mm pitch devices even the Semiconductor and wafer,

the quality of stencil fabrication and the control of its use process becomes increasingly important.

Our Sunmetna stencil inspection system SVII-H6 stencil inspection system effectively solves the below industry issues:

1.How to effectively control the quality of stencil apertures?

2.How to control the cleaning quality of stencil in the process of use?

3.How to effectively monitor the service life and status of stencil?

4.How to provide effective data and evidence to ensure that the stencil used by the factory is in normal condition?

SVII-H6 Technical Parameters